Mobile phones, laptops, digital products, audio parts bonding, three protective adhesive, electronic components as potting glue, circuit board as potting glue, FPC flexible circuit board polyimide (PI) or polyester (PE) film composite copper foil, electronic parts surface with UV coating.
Product specification |
Product Series |
Viscosity
mpa.s |
Recommended operating temperature （ ℃） |
Product application |
LE-5173 |
PUR |
5500 ± 1 000
(110 ℃ ) |
110-130 |
Used to seal and bond components and structures of electronic products such as mobile phones, laptops, tablets, liquid crystal displays, navigators, e-books and digital products |
LE-5174 |
PUR |
1800 ± 2000
(60 ℃ ) |
25-35 |
The viscosity is small, the glue flows smoothly, the opening time is long, Can be used at room temperature without heating. Used for earphones, speakers, and electronic labels. |
LE-9801 |
PUR |
3000 ± 1000
(80 ℃ ) |
60-100 |
Specially designed and developed for FPC flexible circuit boards polyimide (PI) or polyester (PE) film materialscomposite copper foil |
LE-P51 |
Tow -components
polyurethane |
4 ： 1
Mix Viscosity
1000 ± 3 00
(23 ℃） |
25-35 |
It has good insulation and moisture-proof performance, suitable for the packaging and sealing of electronic and electrical components and circuit boards |
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